On 13 November 2018, Techbond Group Bhd (Techbond) has officially released its IPO document and has opened application for its IPO shares at a price of RM 0.66 a share.
Applications will be closed at 5.00 p.m. on 23 November 2018 and its shares are scheduled for listing on Bursa Malaysia on 5 December 2018.
Question here is: Should You Apply for this IPO?
Before you do, I have downloaded its IPO document and have taken my time to study it. You can also check the IPO prospectus here.
That said, I have summarized 7 things you need to know about Techbond before applying its IPO shares.
#1: Techbond Business ModelFounded in 1992, Techbond manufactures water-based and hot melt industrial adhesives from two locations.
The first is in Shah Alam, Malaysia. The second is in the Binh Duong Factory Complex, Vietnam.
Its products are sold both locally and abroad
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