Singapore Corporate Bond New Issue Chip Eng Seng 3 Yrs 4.25%
By Doctor Wealth  •  October 10, 2014

- New Chip Eng Seng SGD 3yrs announced with strong IOIs received post SG roadshow
-Price: 4.25%
– Issue size:  $150 Mil

pinnacle

– Comps:
Tuan Sing 4.5 2019 at 100, 4.50%
Koh Brothers 4.8 2018 at 101, 4.46%

Credit Highlights:
–    Chip Eng Seng Corporation Ltd. (“CES”) is a diversified real estate company with core businesses in construction and property development in Singapore and Australia
–    Listed on the Mainboard of the SGX-ST since November 1999, CES has a market capitalisation of SGD564m as at 8 October 2014
–    Well-established track record of over 30 years’ experience in general construction and is a leading contractor for public housing projects and recognised developer of quality properties
–    Construction arm is registered with the Building and Construction Authority under the A1 classification for general building construction and civil engineering, allowing it to tender for public sector projects ...

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By Doctor Wealth
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